NotEntirelyConfused
Power User
- Joined
- May 15, 2024
- Posts
- 117
AT had an article today about how thinner LPDDR5x modules would improve smartphones by allowing them to be thinner, or by allowing for more airflow and thus better heat dissipation.
Is "airflow" really a thing in phones? Maybe convection creates a little bit I guess? It occurs to me that if you have a RAM package sitting on top of your processor, it's acting as a tiny insulator, and so the thinner it gets, the less insulation, thus better heat transfer to air (or a heat spreader or whatever). I naively think that that might be more significant than the air gap above the CPU (if indeed such even exists - it won't if there's a spreader). But I really know way too little about this.
Can anyone with more knowledge explain?
Is "airflow" really a thing in phones? Maybe convection creates a little bit I guess? It occurs to me that if you have a RAM package sitting on top of your processor, it's acting as a tiny insulator, and so the thinner it gets, the less insulation, thus better heat transfer to air (or a heat spreader or whatever). I naively think that that might be more significant than the air gap above the CPU (if indeed such even exists - it won't if there's a spreader). But I really know way too little about this.
Can anyone with more knowledge explain?