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Maybe, but they probably still want to keep single-chip solutions for laptops. I can imagine that the die connector comes with a power usage overhead.
They already distinguish the ”base” M1/2 chip from the “max” so I would expect them to continue that. But I could see this other solution for anything Max (or maybe Pro) and higher.
The die connectors shouldn’t add much power at all as long as they are passive. Looking at the M2 Max die photos, there are already some long communication paths, and only a small portion of each of those wires would have somewhat higher capacitance than now.