possible. The one thing that gives it credence is that Reuters report linked in the article that at least one customer, Broadcom, was unhappy with Intel’s 18A progress and IIRC poor yields were thought to be the issue. So there is supporting evidence. Further, this time last year, Arrow Lake was still reportedly using 20A which obviously didn’t happen. As aforementioned though, even if yields are bad now, and they may not be, the node isn’t supposed to be available for mass production yet anyway so yields have time to improve.
Possibly fair, I’d have to check. I was under the impression this leak was the exact same as Qualcomm’s issue, they wanted better HD libraries.
Either way, what we literally do know is:
A) Intel realizes this [and mobile or mass embedded or Arm server targeting] is a problem and has a separate process modification for 18A along with tacitly acknowledging this flaw in their own presentations.
And B) Samsung’s nodes are so bad that even Google is passing up on 3NM GAAFET for TSMC N3E next year, and Samsung swapped the 2400’s planned 2/3NM for an updated 4NM LPP+ process (which still only shipped in the 24 Ultra for most), and the 2500 2/3NM 2025 rumors are intact also dicey again, with major reorganizations and crisis inside Samsung’s logic foundry part n/n in the last 5 years recently.
I am pretty comfortable saying Intel has a good shot by the 2026-2028 timeframe for a process that’s good enough for ultra mobile at some discount, which, mind you, we really just don’t have right now. It’s not even about being “as good as TSMC” through and through: you can’t even buy a true TSMC N4P competitor +-10-15 % power/density right now at scale.
The hope with Intel is they at least have some basics down on power/performance and Samsung’s problems predate GAA.
My main concern is that if the report is accurate then that Samsung also struggled with GAA yields could indicate an intrinsic issue with GAA fabrication for mass production
Nah. More than FinFET sure, but FinFET had teething pains too, but it was still amazing. You don’t get this far past research and trials for HVM to be a shot in the dark. I will totally acknowledge if I’m wrong but I’d bet it ends just fine. The main benefit of GAA is an intrinsic advantage to power/performance at the same density/chemical treatment/architecture (just like FinFET offered this over Planar) along with tailoring some geometries in ways not possible with FinFET. And just basic leakage reduction again which is becoming more of power consumption at denser nodes
that TSMC will also hit even though they’re being more cautious in their timeline to bring it to market. Of course the report could be wrong and/or TSMC’s more cautious approach may pay off where their GAA N2 node is fine.
Remember this is Intel and Samsung. And TSMC’s N5 & N3E were really exceptional aberrations, N7/N10 (or 12 whatever) weren’t even as rapid re reductions in defects and stuff even though they were great.
I disagree. If Gelsinger had been under pressure from "activist investors" and routinely suffering votes of no confidence in shareholder meetings then I would agree that this was Wall Street mucking things up for short term profit.
I mean he was under pressure from AI, but yes it didn’t reach that point. Coming out of the blue really doesn’t make much difference to me, the behavior from the street can differ! They have been whining about Intel’s cash flow for a while. Wall Street wanted them to sell the fabs.
But this came out of the blue (well at least to us, we don't know how contentious board meetings were before this, see the edit below) after a meeting with the board after the board and the company had expressed massive confidence in Gelsinger by abjuring their retirement rules to keep him long term. All that to me indicates something substantial in Gelsinger's plan to turn Intel around failed badly enough that they had to take this step. Maybe it was just the AI progress or lack thereof, but it could be the fabs.
I mean it was always dependent on government aid at the end of the day. Gelsinger is a politician and visionary on some level, his ideas here on fabs in the west and an open Intel foundry are living on even if our sloth ends up quashing them.
Turning around Intel for 0-10 year pure financial wins would be selling the fabs off and going to TSMC and Samsung for cheaper stuff indefinitely, and adopting their packaging too. That’s the truth. The fabs were never going to be a short or even medium term financial win. Never. What Gelsinger probably didn’t expect was Intel@/ design to decline as much as it did which means this strategy for the long long run to save the design unit from itself (and Intel’s overall profit) is unsustainable because they cannot fund the capex expansions.
10’s Intel absolutely could have but they were screwing around on bad phone chip contra revenue, manycore GPU imitations, dumb drones, buying Altera, half-assing modems etc
EDIT:
This is potentially interesting:
No decision has been made yet.
www.tomshardware.com
EDIT2:
Also this:
SRAM is hard to scale.
www.tomshardware.com
SRAM is just one metric of course. Hopefully we'll get comparable designs like the same ARM core on both nodes. That'll be fun for people to deep dive on.